agilent ACPF-7003 high rx and image rejection tx filter for us pcs band data sheet features ? ? ? ? ? high rejection from a single filter with no switches required ? ? ? ? ? true split band replacement ? ? ? ? ? passband: 1850-1910 mhz ? ? ? ? ? 35 db min attenuation, 1930-1990 mhz ? ? ? ? ? 2.5 db typical insertion loss ? ? ? ? ? 25db image rejection at 1830 mhz ? ? ? ? ? space saving solution ? ? ? ? ? small footprint: ? ? ? ? ? 1.6 x 2.0-mm solution ? ? ? ? ? low profile package: ? ? ? ? ? 0.9 mm high (typ) ? ? ? ? ? 1.0mm (max) applications ? ? ? ? ? us pcs band handsets ? ? ? ? ? wireless data terminals general description the ACPF-7003 is a high rejection full band transmit filter designed for us pcs handsets. its performance rivals splitband surface acoustic wave (saw) transmit filters. since a single filter provides the rejection, no switches are required, saving board space and external components, eliminating switch loss, and reducing programming complexity. furthermore, with 25db rejection at 1830 mhz, it is a true split band replacement. the ACPF-7003 fbar transmit filter utilizes agilents microcap bonded-wafer chip scale packaging technology. this process allows the ultra small filters to be assembled into a molded chip on board (mcob) module. in typical cellular phone architectures, the transmit filter fits between the driver amplifier and the power amplifier. this filter reduces the noise in the rx band being amplified by the transmit chain, enhancing receiver sensitivity. high rejection keeps unwanted signals out of the receive path. agilents thin-film bulk acoustic resonator (fbar) technology makes possible high-q filters at a fraction their usual size.
2 absolute maximum ratings [2] notes: 1. temperature is defined at case t c , the temperature of the underside of the filter where it makes contact with the circuit board. 2. specifications are guaranteed over the given temperature range. operation in excess of any one of these conditions may result in permanent damage to the device. parameter unit value operating temperature [1] c -30 to +85 storage temperature [1] c -40 to +125 electrical specifications, zo=50 ? ? ? ? ? symbol parameters units +25 c -30 to +85 c min typ max min typ max f passband [1850.6 - 1909.4] mhz il insertion loss 1850.6-1855 mhz db 2.0 3.5 3.5 il insertion loss 1855-1905 mhz db 1.5 2.5 2.5 il insertion loss 1905-1909.4 mhz db 2.5 3.0 3.0 ? s21 ripple, 1850-1910 mhz db 2.5 s21 min rejection, 1930.6-1990 mhz db 35 45 35 45 s21 min rejection 10 -1715 mhz db 25 25 s21 min rejection 1715 - 1785 mhz db 25 25 s21 min rejection 1785 - 1830 mhz db 25 25 s21 min rejection 1990 - 2500 mhz db 30 30 s21 min rejection 2500 - 3820 mhz db 22 22 s21 min rejection 3820 - 5730 mhz db 15 15 s11, s22 in-band return loss db 10 13 10 13 pin max safe input power level dbm 20 20
3 typical performance (25 c, zo = 50 ohms) figure 2. insertion loss (db) vs. frequency figure 1. attenuation (db) vs. frequency figure 3. attenuation (db) vs. frequency (broadband) figure 4. return loss (db) vs. frequency figure 5. s(1,1) figure 6. s(2,2)
4 pcb interface & mounting instructions mounting consideration and board description the ACPF-7003 fbar filter has one input (pin 1), one output (pin 3) and two grounds (pins 2 and 4.) ? demo board uses 3 mil getek microstrip. the demo board uses cpwg transmission lines for high isolation between the two ports. it uses via holes to connect the cpwg line from the underside of the board to the filter mounting pads on top. note: for best performance, try to reproduce this board stack up closely. if ground- signal-ground (gsg) type board is used, better return loss can be achieved since it eliminates connector mismatch. demo boards demo boards are available for sampling. (see board drawing in figures 7, 8, and 9.) figure 7. board stack up description figure 9. closer look at the recommended board footprint and soldermask figure 8. pcb footprint pad output connection input connection back top 3 mils layer 2 (ground) layer 3 (signal) getek ml200d ( t =3.9) 28 mils 0.7 mils getek ml200d ( t =4.2) layer1 (signal) getek ? material ml200d and rg200d getek ? ml200d ( =3.9) getek ? ml200d ( =4.2) 0.7 mils
5 figure 11. suggested pcb layers figure 10. detailed bottom, side and top view of package (dimensions in mm) 2.0 4 2 3 1.25 max shaded region grounded a 0.60 0.15 d c b pin 1 marking 1.6 1 side view 0.35 0.15 8x 0.60 0.15 layer 1 via to layer 2 this region is soldermask covering ground region (4) & (2) is exposed ground for soldering filter pads 2 4 dimension in mm in 1 out 3 1.5 1.92 0.61 0.70 0.61 0.30 0.3 layer 2 (ground layer) 0.3 metal voided to decrease capacitance at input port metal voided to decrease capacitance at output port 0.3 0.55 0.31 0.55 0.05 0.30 0.05 0.33
6 figure 13. carrier tape drawing figure 12. recommended solder profile alloy type melting temperature ( o c) recommended working temperature ( o c) alloy type melting temperature ( o c) recommended working temperature ( o c) sn42bi58 138 160 - 180 sn95.8ag3.5cu0.7 217 235 - 255 sn43pb43bi14 144 - 163 165 - 185 sn96.5ag3.5 221 240 - 260 sn63pb37 183 200 - 240 sn100 232 260 - 280 sn60pb40 186 200 - 240 sn95sb5 235 260 - 280 sn91/zn9 199 200 - 240 sn97cu3 240 260 - 300 sn96.2ag2.5cu0.8sb0.5 216 235 - 255 0 50 100 150 200 250 300 0 50 100 150 200 250 300 time, seconds temperature, ?c tested profile shown. note: 1. measured from the centreline of the sprocket hole to the centreline of the pocket hole and from the centreline of the sprocket hole to the centerline of the pocket 2. cumulative tolerance of 10 sprocket hoels is 0.20 3. this thickness is applicable as measured at the edge of the tape. 4. material: black polystyrene 5. all dimensions in mm. 6. allowable camber to be 1mm per 250mm in length 7. unless otherwise specified tolerance 0.10. 8. measurement point to be 0.3 from bottom pocket. 9. surface resisitivty from 1.0x10 to 1.0x10 ohms/sq 5 11 user direction of unreeling 0.30 0.05(3) 2.00 0.05(1) 4.0(2) ? 1.50 1.90(8) 4.00 1.20 ? 1.0 min. 8.0 0.3 8? typ 2.30(8) 3.5 0.05(1) 1.75 +0.10 -0.00
7 figure 14. reel drawing figure 16. device orientation in the carrier tape figure 15. tape and reel orientation notes: 1. cover tape material is clear polyester film coated with heat activated and anti static properties. 2. all dimensions are in mm except tape length. 3. surface resistivity: 10 10 to 10 11 ohms/sq. user feed direction cover tape carrier tape reel user feed direction ab pin 1 position ab ab c : pin 1 location : work week : date code : lot number a b c,d top view end view d cd cd empty pocket/cavity leader : 125 pocket - 1 trailer : 125 pocket - 1
www.agilent.com/ semiconductors for product information and a complete list of distributors, please go to our web site. for technical assistance call: americas/canada: +1 (800) 235-0312 or (408) 654-8675 europe: +49 (0) 6441 92460 china: 10800 650 0017 hong kong: (+65) 6756 2394 india, australia, new zealand: (+65) 6755 1939 japan: (+81 3) 3335-8152(domestic/inter- national), or 0120-61-1280(domestic only) korea: (+65) 6755 1989 singapore, malaysia, vietnam, thailand, philippines, indonesia: (+65) 6755 2044 taiwan: (+65) 6755 1843 data subject to change. copyright ? 2005 agilent technologies, inc. january 31, 2005 5989-1791en ordering information ACPF-7003-blk = bulk option, 100 pieces per antistatic bag ACPF-7003-tr1 = tape and reel option, 3000 pieces per 7-inch reel
|
